RAM inline sputtering deposition system
It is a device that can be transitioned from a pilot line to a mass production line.
This is a deposition-up horizontal inline sputtering device equipped with RAM cathodes (four-sided opposing low-damage sputtering cathodes) and strong magnetic field planar cathodes. To avoid damaging the underlying layer, the initial layer is deposited using low-damage sputtering with the RAM cathode. After that, high-speed deposition is performed with the strong magnetic field cathode. Each of the load lock stockers and unload lock stockers is vacuum-stored with 15 trays each. *For more details, please refer to the PDF document or feel free to contact us.*
- Company：京浜ラムテック
- Price：Other
